Wafer Chip Solutions

Ultra thin cutting sheet

It is mainly used for cutting silicon chips, semiconductor compound chips, oxide chips, chip LED substrates, various semiconductor packaging components and other materials.

Material: (SD) diamond/(CBN) cubic boron nitride

Main features:

1. Shorten pre cutting time, reduce chip splash, damage, breakage and snaking

2. Improve the processing quality under high rotation number

3. Capable of difficult chamfering and step cutting

4. The loading and unloading operation is more convenient, which can greatly reduce the time required for cutting blade exchange and equipment maintenance

5. Stable processing of narrow cutting path can be realized