Wafer Chip Solutions
It is mainly used for cutting silicon chips, semiconductor
compound chips, oxide chips, chip LED substrates, various
semiconductor packaging components and other materials.
Material: (SD) diamond/(CBN) cubic boron nitride
Special ceramic grinding wheel for knee joint grinding
Material: (SD) diamond/(CBN) cubic boron nitride
Processing object: used for grinding bone joints and other products
Features: 1. Accurate size; 2. High efficiency; 3. High durability;
It is mainly used for cutting silicon chips, semiconductor
compound chips, oxide chips, chip LED substrates, various
semiconductor packaging components and other materials.
Material: (SD) diamond/(CBN) cubic boron nitride
Ceramic grinding wheel for automobile camshaft
Material: (SD) diamond/(CBN) cubic boron nitride
Processing object: mainly used for automobile parts grinding
Good molding effect, high efficiency, long service life,
Ceramic CBN grinding wheel/electroplated CBN grinding wheel
Material: (SD) diamond/(CBN) cubic boron nitride
Processing object: nickel base superalloy blade
Good heat dissipation, high machining accuracy and high surface finish
Incorporation
Area Covered
Grinding Wheel Team
Patent Certificate
Yubao Exhibition CIMT2019Time: April 15-20, 2019 (09:00-17:30)Venue: Beijing · C
Detailed+The biennial China CNC Machine Tool Exhibition will invite you to the exhibition
Detailed+Centerless grinding machine is a kind of grinding machine that does not need to
Detailed+Electroplated superhard abrasive wheel has the characteristics of high grinding
Detailed+